TNI-U Desoldering Wick - TU-3015

  • RM5.00

  • Brand: TNI-U
  • Product Code: TU-3015
  • Availability: In Stock

 

Desoldering Wick (Braid) significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Desoldering Wick (Braid) optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action. Minimal flux residue on the board speeds up the cleaning process or eliminates it entirely. Desoldering Wick (Braid) is available in the most comprehensive variety of widths, lengths and flux types. Application-specific sizes allow for precision solder removal in a flash. Desoldering Wick (Braid) is completely protected from the harmful effects of the environment

 

Application

  • Safely removes solder from Ball Grid Array Chips and Pads

 

Features

  • Sized and designed specifically for BGA pad and chip rework/repair
  • Entire BGA pads cleaned in three to four passes
  • Available in rosin and no-clean fluxes

 

Specifications

  • Length: 1.5 meters
  • Width: 3.0mm
  • Dimensions: 60mm x 60mm x 10mm

 

Package Includes

  • 1 x  TU-3015

 

How to use

  • Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick, the solder will be absorbed.
  • Remove the desoldering wick after the solder has been absorbed.
  • Cut off the used section of the wick using nippers.
  • Repeat above steps if the solder is not removed completely. Absorbability may differ depending on the type of solder. Sn63% and 60% (tin content) have good absorbability.

 

 

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